Publication: Flip chip bonding on stretchable printe...
Master data
Title: | Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation |
Subtitle: | |
Abstract: | Abstract Stretchable printed electronics have recently opened up new opportunities and applications, including soft robotics, electronic skins, human-machine interfaces, and healthcare monitoring. Stretchable hybrid systems (SHS) leverage the benefits of low-cost fabrication of printed electronics with high-performance silicon technologies. However, direct integration of silicon-based devices on conventional stretchable substrates such as thermoplastic polyurethane (TPU) and polydimethylsiloxane (PDMS) is extremely challenging due to their restricted low-temperature processing. In this study, a recently developed thermoset, stretchable substrate (BeyolexTM) with superior thermal and mechanical properties was employed to realize SHS via direct flip chip bonding. Here, ultra-thin chips (UTC) with a fine-pitch, daisy-chain structure was flip-chip bonded by using anisotropic conductive adhesives, while the complementary circuitry was facilitated via screen-printed, stretchable silver tracks. The bonded samples successfully passed reliability assessments after being subjected to cyclic 30% stretch tests for 200 cycles. The potential benefits of chip encapsulation after integration with the stretchable substrate to withstand larger strains were demonstrated by both mechanical simulation and experimental results. |
Keywords: | Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials |
Publication type: | Article in journal (Authorship) |
Publication date: | 24.01.2023 (Online) |
Published by: |
Flexible and Printed Electronics
Flexible and Printed Electronics
(
IOP Publishing Ltd.;
)
to publication |
Title of the series: | - |
Volume number: | 8 |
Issue: | 1 |
First publication: | Yes |
Version: | - |
Page: | - |
Total number of pages: | 015004 pp. |
Versionen
Keine Version vorhanden |
Publication date: | 24.01.2023 |
ISBN (e-book): | - |
eISSN: | 2058-8585 |
DOI: | http://dx.doi.org/10.1088/2058-8585/acb2d9 |
Homepage: | - |
Open access |
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Publication date: | 01.03.2023 |
ISBN: | - |
ISSN: | - |
Homepage: | - |
Authors
Muhammad Hassan Malik (external) |
Jaroslaw Kaczynski (external) |
Hubert Zangl (internal) |
Ali Roshanghias (external) |
Assignment
Organisation | Address | ||||
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Fakultät für Technische Wissenschaften
Institut für Intelligente Systemtechnologien
|
AT - 9020 Klagenfurt am Wörthersee |
Categorisation
Subject areas | |
Research Cluster | No research Research Cluster selected |
Citation index |
Information about the citation index: Master Journal List
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Peer reviewed |
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Publication focus |
Classification raster of the assigned organisational units:
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working groups | No working group selected |
Cooperations
Organisation | Address | ||
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Silicon Austria Labs GmbH
|
AT - 9524 Villach |
Research activities
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Publications: | No related publications |
Events: | No related events |
Lectures: | No related lectures |