Master data

Title: Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
Subtitle:
Abstract:
Keywords: Electrical and Electronic Engineering, Surfaces, Coatings and Films, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Electronic, Optical and Magnetic Materials
Publication type: Article in journal (Authorship)
Publication date: 01.08.2021 (Online)
Published by: Microelectronics Reliability
Microelectronics Reliability
to publication
 ( Elsevier Science Inc.; )
Title of the series: -
Volume number: 123
Issue: -
First publication: Yes
Version: -
Page: -
Total number of pages: 114204 pp.

Versionen

Keine Version vorhanden
Publication date: 08.2021
ISBN: -
ISSN: 0026-2714
Homepage: -
Publication date: 01.08.2021
ISBN (e-book): -
eISSN: -
DOI: http://dx.doi.org/10.1016/j.microrel.2021.114204
Homepage: -
Open access
  • Available online (open access)

Assignment

Organisation Address
Fakultät für Technische Wissenschaften
 
Institut für Intelligente Systemtechnologien
Universitätsstraße 65-67
9020 Klagenfurt am Wörthersee
Austria
   hubert.zangl@aau.at
http://www.uni-klu.ac.at/tewi/ict/sst/index.html
To organisation
Universitätsstraße 65-67
AT - 9020  Klagenfurt am Wörthersee

Categorisation

Subject areas
Research Cluster
  • Self-organizing systems
Citation index
  • Science Citation Index Expanded (SCI Expanded)
Information about the citation index: Master Journal List
Peer reviewed
  • Yes
Publication focus
  • Science to Science (Quality indicator: II)
Classification raster of the assigned organisational units:
working groups
  • Sensor- und Aktortechnik

Cooperations

Organisation Address
Silicon Austria Labs GmbH
High Tech Campus Villach ‑ Europastraße 12
9542 Villach
Austria - Carinthia
High Tech Campus Villach ‑ Europastraße 12
AT - 9542  Villach

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