Publikationen
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Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives
(2021)
M. Malik, G. Grosso, H. Zangl, A. Binder, A. Roshanghias
Microelectronics Reliability
Kein Verlag ausgewählt
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Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
(2022)
M. Malik, A. Tsiamis, H. Zangl, A. Binder, S. Mitra, A. Roshanghias
Electronics
Kein Verlag ausgewählt
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Min-Max Vertex Cycle Covers With Connectivity Constraints for Multi-Robot Patrolling
Min-Max Vertex Cycle Covers With Connectivity Constraints for Multi-Robot Patrolling
(2022)
J. Scherer, A. Schoellig, B. Rinner
IEEE Robotics and Automation Letters
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Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
Ultra-Thin Chips (UTC) Integration on Inkjet-Printed Papers
(2022)
M. Malik, L. Rauter, H. Zangl, A. Binder, A. Roshanghias
2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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Evaluation of low cost sealing methods to protect sustainable printed temperature sensors against degradation due to UV irradiation
Evaluation of low cost sealing methods to protect sustainable printed temperature sensors against degradation due to UV irradiation
(2021)
L. Rauter, J. Zikulnig, M. Malik, S. Khan, L. Faller, H. Zangl, J. Kosel
IEEE Sensors 2021
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Capacitive Proximity and Tactile Perception Towards Continuous Patient Monitoring
Capacitive Proximity and Tactile Perception Towards Continuous Patient Monitoring
(2021)
H. Zangl, C. Schöffmann
PETRA 2021
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Printed wireless battery-free humidity sensor for integration into lightweight construction parts
Printed wireless battery-free humidity sensor for integration into lightweight construction parts
(2022)
L. Rauter, J. Zikulnig, T. Moldaschl, D. Holzmann, H. Zangl, L. Faller, J. Kosel
2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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Two-Level Sensor Self-Calibration Based on Interpolation and Autoregression for Low-Cost Wireless Sensor Networks
Two-Level Sensor Self-Calibration Based on Interpolation and Autoregression for Low-Cost Wireless Sensor Networks
(2023)
R. Ahmad, B. Rinner, R. Wazirali, S. Abujayyab, R. Almajalid
IEEE Sensors Journal
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Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation
Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation
(2023)
M. Malik, J. Kaczynski, H. Zangl, A. Roshanghias
Flexible and Printed Electronics
Kein Verlag ausgewählt
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A low-cost table-top robot platform for measurement science education in robotics and artificial intelligence
A low-cost table-top robot platform for measurement science education in robotics and artificial intelligence
(2023)
H. Zangl, N. Anandan, A. Kafrana
Acta IMEKO
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Printed Wireless Battery-Free Sensor Tag for Health Monitoring of Polymer Composites
Printed Wireless Battery-Free Sensor Tag for Health Monitoring of Polymer Composites
(2023)
L. Rauter, J. Zikulnig, T. Moldaschl, D. Holzmann, L. Neumaier, M. Khalifa, H. Zangl, L. Faller, J. Kosel
IEEE Journal on Flexible Electronics
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Sustainable Multifunctional Biface Sensor Tag
Sustainable Multifunctional Biface Sensor Tag
(2023)
L. Rauter, J. Zikulnig, T. Moldaschl, M. Lenzhofer, S. Khan, L. Neumaier, S. Lengger, T. Beduk, M. Malik, M. Jose, H. Zangl, J. Kosel
Advanced Sensor Research
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Machine Learning for Wireless Sensor Networks Security: An Overview of Challenges and Issues
Machine Learning for Wireless Sensor Networks Security: An Overview of Challenges and Issues
(2022)
R. Alshwaiyat, R. Wazirali, T. Abu-Ain
Sensors
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A Portable Sensor System for Structural Health Monitoring with Printed Sensors on Biodegradable Substrates
A Portable Sensor System for Structural Health Monitoring with Printed Sensors on Biodegradable Substrates
(2023)
L. Rauter, H. Gietler, J. Zikulnig, M. Khalifa, H. Zangl, J. Kosel
2023 IEEE SENSORS
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